Spectra based endpointing for chemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsBoguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Materials, Inc.
InventorsBoguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David
Estimating the term…
Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
A computer program product, tangibly stored on machine readable medium, the product comprising instructions operable to cause a processor to:
A computer program product, tangibly stored on machine readable medium, the product comprising instructions operable to cause a processor to:
Dependencies are inferred from the claim text.