Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method
AssigneeEbara Corporation
InventorsToshifumi Kimba, Kohei Ohshima, Kohei Ota
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AssigneeEbara Corporation
InventorsToshifumi Kimba, Kohei Ohshima, Kohei Ota
Estimating the term…
A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a transparent-liquid supply line coupled to an inlet port provided in the cover member and configured to supply a transparent liquid onto the polishing pad through the inlet port. The cover member has a light transmissive portion on an optical path of the light and the reflected light.
A surface property measuring system comprising:
A surface property measuring system comprising:
A surface property measuring system comprising:
A surface property measuring system comprising:
A surface property measuring method comprising:
Dependencies are inferred from the claim text.