B23K 35/3618
Carboxylic acids or salts
Official title: {Carboxylic acids or salts}
B23K35/3618 (Carboxylic acids or salts) appears on 264 US grants and 222 published applications in this corpus.
Search patents in B23K- Granted patents
- 264
- Published applications
- 222
- Assignees
- 144
- Inventors
- 633
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 10 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 6 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 9 | 0 |
| 2000 | 7 | 0 |
| 2001 | 5 | 4 |
| 2002 | 11 | 10 |
| 2003 | 14 | 10 |
| 2004 | 6 | 10 |
| 2005 | 7 | 10 |
| 2006 | 4 | 4 |
| 2007 | 6 | 4 |
| 2008 | 1 | 3 |
| 2009 | 4 | 6 |
| 2010 | 3 | 5 |
| 2011 | 2 | 5 |
| 2012 | 3 | 6 |
| 2013 | 5 | 13 |
| 2014 | 2 | 9 |
| 2015 | 9 | 15 |
| 2016 | 6 | 14 |
| 2017 | 12 | 12 |
| 2018 | 11 | 10 |
| 2019 | 6 | 5 |
| 2020 | 7 | 11 |
| 2021 | 7 | 6 |
| 2022 | 7 | 15 |
| 2023 | 13 | 13 |
| 2024 | 7 | 9 |
| 2025 | 12 | 11 |
| 2026 | 8 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for attaching a first connection partner to a second connection partner5 May 2026US 12,617,046 B2Infineon Technologies AG
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- Indium solder paste compositions3 Mar 2026US 12,564,907 B2Ormet Circuits, Inc.
- Stable undercooled metallic particles for filling a void24 Feb 2026US 12,559,824 B2Iowa State University Research Foundation, Inc.
- Soldering method30 Jul 2026US 2026/0216807 A1Infineon Technologies AG
- Flux and solder paste23 Apr 2026US 2026/0108989 A1Senju Metal Industry Co., Ltd.
- Composition containing metal particles, bonding paste, and bonding body30 Oct 2025US 2025/0332665 A1artience Co., Ltd.
- Flux and solder paste21 Aug 2025US 2025/0262692 A1Senju Metal Industry Co., Ltd.
- Flux and solder paste14 Aug 2025US 2025/0256362 A1Senju Metal Industry Co., Ltd.
Most cited
By later US patents
- Semiconductor flip-chip package and method for the fabrication thereof227US 6,335,571 B12002
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- Semiconductor flip-chip package and method for the fabrication thereof141US 6,121,689 AMiguel Albert Capote · 2000
- Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits106US 5,985,456 A1999
- Semiconductor flip-chip package and method for the fabrication thereof101US 6,518,677 B12003