B23K 35/3613
Polymers
Official title: {Polymers, e.g. resins}
B23K35/3613 (Polymers) appears on 432 US grants and 475 published applications in this corpus.
Search patents in B23K- Granted patents
- 432
- Published applications
- 475
- Assignees
- 254
- Inventors
- 1,036
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 10 | 0 |
| 1993 | 8 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 7 | 0 |
| 1999 | 12 | 0 |
| 2000 | 8 | 0 |
| 2001 | 7 | 7 |
| 2002 | 13 | 11 |
| 2003 | 12 | 13 |
| 2004 | 13 | 12 |
| 2005 | 6 | 12 |
| 2006 | 5 | 13 |
| 2007 | 8 | 16 |
| 2008 | 5 | 12 |
| 2009 | 9 | 10 |
| 2010 | 5 | 14 |
| 2011 | 7 | 16 |
| 2012 | 7 | 14 |
| 2013 | 10 | 17 |
| 2014 | 16 | 33 |
| 2015 | 10 | 35 |
| 2016 | 11 | 36 |
| 2017 | 30 | 36 |
| 2018 | 23 | 28 |
| 2019 | 22 | 20 |
| 2020 | 26 | 14 |
| 2021 | 16 | 25 |
| 2022 | 12 | 14 |
| 2023 | 18 | 22 |
| 2024 | 12 | 21 |
| 2025 | 19 | 16 |
| 2026 | 12 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flux14 Jul 2026US 12,678,896 B2Koki Company Limited
- Light-absorbing epoxy film and manufacturing method thereof2 Jun 2026US 12,643,182 B2Hojeonable Inc.
- Flux-coated ball and method for manufacturing same26 May 2026US 12,636,737 B2Senju Metal Industry Co., Ltd.
- Bottom ohmic silver paste for strontium titanate ring varistor, preparation method and use thereof5 May 2026US 12,617,043 B2Guangzhou Newlife New Material Co., Ltd.
- Flux and solder paste21 Apr 2026US 12,605,794 B2Senju Metal Industry Co., Ltd.
- Non-magnetization modification source-containing paste, non-magnetization device, rotor core, and method for manufacturing the same1 Oct 2026US 2026/0295736 A1Honda Motor Co., Ltd.
- Copper microparticle dispersion10 Sep 2026US 2026/0264178 A1Kao Corporation
- Solder paste20 Aug 2026US 2026/0241494 A1Heraeus Materials Technology Shanghai Ltd.
- Mixed powder for paste brazing materials, and paste brazing material using same25 Jun 2026US 2026/0175331 A1Fukuda Metal Foil & Powder Co., Ltd.
- Curable resin composition for solder resist use18 Jun 2026US 2026/0166660 A1Shin-Etsu Chemical Co., Ltd.
Most cited
By later US patents
- Multiple material systems for selective beam sintering335US 5,076,869 ABoard of Regents, The University of Texas System · 1991
- Semiconductor flip-chip package and method for the fabrication thereof227US 6,335,571 B12002
- Semiconductor flip-chip assembly with pre-applied encapsulating layers169US 6,297,560 B12001
- Adhesive and encapsulant material with fluxing properties147US 5,128,746 AMotorola, Inc. · 1992
- Semiconductor flip-chip package and method for the fabrication thereof141US 6,121,689 AMiguel Albert Capote · 2000