B23K 35/025
Pastes, creams or slurries
Official title: {Pastes, creams or slurries}
B23K35/025 (Pastes, creams or slurries) appears on 765 US grants and 959 published applications in this corpus.
Search patents in B23K- Granted patents
- 765
- Published applications
- 959
- Assignees
- 410
- Inventors
- 1,917
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 17 | 0 |
| 1996 | 8 | 0 |
| 1997 | 12 | 0 |
| 1998 | 10 | 0 |
| 1999 | 17 | 0 |
| 2000 | 18 | 0 |
| 2001 | 19 | 10 |
| 2002 | 24 | 15 |
| 2003 | 20 | 23 |
| 2004 | 13 | 23 |
| 2005 | 16 | 21 |
| 2006 | 9 | 15 |
| 2007 | 9 | 22 |
| 2008 | 7 | 19 |
| 2009 | 12 | 26 |
| 2010 | 11 | 19 |
| 2011 | 10 | 18 |
| 2012 | 9 | 22 |
| 2013 | 10 | 37 |
| 2014 | 19 | 47 |
| 2015 | 32 | 84 |
| 2016 | 30 | 76 |
| 2017 | 58 | 85 |
| 2018 | 50 | 70 |
| 2019 | 57 | 39 |
| 2020 | 50 | 38 |
| 2021 | 36 | 45 |
| 2022 | 20 | 49 |
| 2023 | 42 | 38 |
| 2024 | 30 | 48 |
| 2025 | 26 | 44 |
| 2026 | 21 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Brazing paste15 Sep 2026US 12,734,617 B2Senju Metal Industry Co., Ltd.
- Active metal brazing substrate and method for manufacturing the same1 Sep 2026US 12,722,359 B2Tong Hsing Electronic Industries, Ltd.
- Semiconductor device including semiconductor element and lead-free solder bonding material and method for manufacturing the same25 Aug 2026US 12,721,207 B2Hitachi Power Semiconductor Device, Ltd.
- Solder paste for module fabrication of solar cells21 Jul 2026US 12,690,277 B2Alpha Assembly Solutions Inc.
- Braze product including additive particles and methods of brazing9 Jun 2026US 12,649,203 B2Lucas-Milhaupt, Inc.
- Non-magnetization modification source-containing paste, non-magnetization device, rotor core, and method for manufacturing the same1 Oct 2026US 2026/0295736 A1Honda Motor Co., Ltd.
- Flux, solder paste, and method for producing joined structure3 Sep 2026US 2026/0257305 A1Koki Company Limited
- Solder paste20 Aug 2026US 2026/0241494 A1Heraeus Materials Technology Shanghai Ltd.
- Diffusion soldering method and solder material20 Aug 2026US 2026/0241495 A1Infineon Technologies AG
- Conductive paste and bonding method using same6 Aug 2026US 2026/0225190 A1Amogreentech Co., Ltd.
Most cited
By later US patents
- Semiconductor flip-chip package and method for the fabrication thereof227US 6,335,571 B12002
- Semiconductor flip-chip assembly with pre-applied encapsulating layers169US 6,297,560 B12001
- Semiconductor flip-chip package and method for the fabrication thereof141US 6,121,689 AMiguel Albert Capote · 2000
- Method of forming an adhesive connection136US 6,077,380 AMicroFab Technologies, Inc. · 2000
- Method for isolating ultrafine and fine particles106US 5,922,403 A1999