Active metal brazing substrate and method for manufacturing the same

A method for manufacturing an active metal brazing substrate, comprising:

• coating an active metal solder paste onto a ceramic substrate, so as to form an active metal layer on the ceramic substrate;
• wherein the active metal solder paste includes an active metal solder and an organic dispersion medium, and a weight ratio between the active metal solder and the organic dispersion medium is 70% to 95%:
• 5% to 30%;
• wherein the active metal solder consists of silver, copper, and an active metal, and the active metal is selected from the group consisting of:
• titanium (Ti), zirconium (Zr), tantalum (Ta), niobium (Nb), vanadium (V), and hafnium (Hf);
• wherein, based on a total weight of the active metal solder being 100 wt %, an amount of the copper ranges from 65 wt % to 80 wt %, and an amount of the silver ranges from 10 wt % to 34 wt %;
• and
• disposing a conductive metal layer onto the active metal layer, and then implementing a brazing process to obtain the active metal brazing substrate;
• wherein a peel strength between the ceramic substrate layer and the conductive metal layer ranges from 165 N/cm to 270 N/cm.

An active metal brazing substrate, comprising:

• a ceramic substrate layer;
• an active metal layer formed from an active metal solder and an organic dispersion medium, the active metal solder consisting of silver, copper, and an active metal;
• wherein the active metal is selected from the group consisting of:
• titanium (Ti), zirconium (Zr), tantalum (Ta), niobium (Nb), vanadium (V), and hafnium (Hf);
• wherein, based on a total weight of the active metal solder being 100 wt %, an amount of the copper is greater than 60 wt % and less than or equal to 80 wt %;
• and
• a conductive metal layer, wherein the active metal layer is disposed between the ceramic substrate layer and the conductive metal layer;
• wherein a peel strength between the ceramic substrate layer and the conductive metal layer ranges from 165 N/cm to 270 N/cm.