B23K 35/0222
For use in soldering or brazing
Official title: {for use in soldering or brazing (B23K35/0205 takes precedence)}
B23K35/0222 (For use in soldering or brazing) appears on 2,386 US grants and 2,823 published applications in this corpus.
Search patents in B23K- Granted patents
- 2,386
- Published applications
- 2,823
- Assignees
- 1,076
- Inventors
- 5,506
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 9 | 0 |
| 1980 | 10 | 0 |
| 1981 | 12 | 0 |
| 1982 | 9 | 0 |
| 1983 | 7 | 0 |
| 1984 | 18 | 0 |
| 1985 | 14 | 0 |
| 1986 | 11 | 0 |
| 1987 | 16 | 0 |
| 1988 | 20 | 0 |
| 1989 | 14 | 0 |
| 1990 | 9 | 0 |
| 1991 | 16 | 0 |
| 1992 | 18 | 0 |
| 1993 | 22 | 0 |
| 1994 | 29 | 0 |
| 1995 | 34 | 0 |
| 1996 | 31 | 0 |
| 1997 | 28 | 0 |
| 1998 | 37 | 0 |
| 1999 | 51 | 0 |
| 2000 | 48 | 0 |
| 2001 | 66 | 25 |
| 2002 | 69 | 65 |
| 2003 | 65 | 67 |
| 2004 | 43 | 83 |
| 2005 | 39 | 63 |
| 2006 | 32 | 71 |
| 2007 | 26 | 60 |
| 2008 | 27 | 65 |
| 2009 | 25 | 79 |
| 2010 | 41 | 76 |
| 2011 | 35 | 86 |
| 2012 | 52 | 96 |
| 2013 | 53 | 131 |
| 2014 | 60 | 163 |
| 2015 | 94 | 223 |
| 2016 | 104 | 210 |
| 2017 | 145 | 211 |
| 2018 | 138 | 191 |
| 2019 | 155 | 130 |
| 2020 | 145 | 111 |
| 2021 | 99 | 133 |
| 2022 | 74 | 109 |
| 2023 | 110 | 123 |
| 2024 | 75 | 113 |
| 2025 | 82 | 93 |
| 2026 | 56 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Solder and electronic component22 Sep 2026US 12,741,343 B2TDK Corporation
- Brazing paste15 Sep 2026US 12,734,617 B2Senju Metal Industry Co., Ltd.
- Copper-tin-nickel brazing material prepared by alloys recycled from E-waste, preparation method therefor and system thereof15 Sep 2026US 12,735,765 B2Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
- Active metal brazing substrate and method for manufacturing the same1 Sep 2026US 12,722,359 B2Tong Hsing Electronic Industries, Ltd.
- Alloy, powder, method and component25 Aug 2026US 12,716,115 B2Siemens Energy Global GmbH & Co. KG
- Improved cable connecting piece8 Oct 2026US 2026/0312306 A1Safetrack Infrasystems SISAB AB
- Non-magnetization modification source-containing paste, non-magnetization device, rotor core, and method for manufacturing the same1 Oct 2026US 2026/0295736 A1Honda Motor Co., Ltd.
- Al-fe-alloy plated steel sheet for hot forming, having excellent twb welding characteristics, hot forming member, and manufacturing methods therefor17 Sep 2026US 2026/0275473 A1Posco
- Bonding sheet, method for producing bonding sheet, and method for producing bonded body3 Sep 2026US 2026/0257304 A1Mitsubishi Materials Corporation
- Flux, solder paste, and method for producing joined structure3 Sep 2026US 2026/0257305 A1Koki Company Limited
Most cited
By later US patents
- Forming structures from CAD solid models580US 6,391,251 B1Optomec Design Company · 2002
- Multiple material systems for selective beam sintering335US 5,076,869 ABoard of Regents, The University of Texas System · 1991
- Direct selective laser sintering of metals293US 6,676,892 B2Board of Regents, The University of Texas System · 2004
- Selective laser sintering using nanocomposite materials286US 5,431,967 ABoard of Regents, The University of Texas System · 1995
- Selective laser sintering of parts by compound formation of precursor powders280US 5,156,697 ABoard of Regents, The University of Texas System · 1992