B23K 35/0227
Rods or wires
Official title: {Rods or wires (B23K35/0244 takes precedence)}
B23K35/0227 (Rods or wires) appears on 210 US grants and 298 published applications in this corpus.
Search patents in B23K- Granted patents
- 210
- Published applications
- 298
- Assignees
- 168
- Inventors
- 627
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 1 |
| 2002 | 2 | 4 |
| 2003 | 2 | 2 |
| 2004 | 4 | 4 |
| 2005 | 0 | 6 |
| 2006 | 4 | 2 |
| 2007 | 0 | 3 |
| 2008 | 0 | 1 |
| 2009 | 1 | 7 |
| 2010 | 3 | 10 |
| 2011 | 0 | 14 |
| 2012 | 5 | 6 |
| 2013 | 3 | 8 |
| 2014 | 4 | 15 |
| 2015 | 7 | 20 |
| 2016 | 6 | 29 |
| 2017 | 14 | 31 |
| 2018 | 17 | 26 |
| 2019 | 21 | 21 |
| 2020 | 26 | 17 |
| 2021 | 13 | 19 |
| 2022 | 6 | 11 |
| 2023 | 12 | 18 |
| 2024 | 15 | 11 |
| 2025 | 9 | 6 |
| 2026 | 8 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Braze product including additive particles and methods of brazing9 Jun 2026US 12,649,203 B2Lucas-Milhaupt, Inc.
- Method for manufacturing soldered products21 Apr 2026US 12,605,783 B2Denso Corporation
- Sn-based alloy solder pastes21 Apr 2026US 12,606,887 B2Heraeus Electronics GmbH & Co. KG
- Aluminum-coated blank, manufacturing method thereof and apparatus for manufacturing aluminum-coated blank17 Mar 2026US 12,576,459 B2Hyundai Steel Company
- Advanced bond coat materials for TBC with improved thermal cyclic fatigue and sulfidation resistance3 Feb 2026US 12,540,375 B2Oerlikon Metco (US) Inc.
- Wear-resistant brazing filler metal, preparation method and use thereof4 Jun 2026US 2026/0151862 A1China Academy of Machinery Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
- Brazed lap joint, method for manufacturing brazed lap joint, and vehicle component23 Apr 2026US 2026/0108964 A1Nippon Steel Corporation
- Copper alloy bonding wire for semiconductor devices9 Apr 2026US 2026/0097454 A1Nippon Micrometal Corporation
- Solder preform with internal flux core including thermochromic indicator19 Mar 2026US 2026/0077436 A1Indium Corporation
- Profiled solder ribbon12 Mar 2026US 2026/0070161 A1Suzhou Maxwell Technologies Co., Ltd.
Most cited
By later US patents
- Method of making lead-free solder and solder paste with improved wetting and shelf life51US 6,680,128 B2Agilent Technologies, Inc. · 2004
- Solder material and method of manufacturing solder material37US 6,186,390 B1Kabushiki Kaisha Toshiba · 2001
- Repair of combustion turbine components35US 7,146,725 B2Siemens Power Generation, Inc. · 2006
- Method of making soldering wire constituted by a core of powder and a metallic tube enclosing the core34US 4,048,705 AAcieries Reunies de Burbach-Eich-Dudelange S.A. ARBED · 1977
- Low toxicity alloy compositions for joining and sealing32US 4,929,423 ACookson Group PLC · 1990