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US 6,680,128 B2Granted
Method of making lead-free solder and solder paste with improved wetting and shelf life
AssigneeAgilent Technologies, Inc.
InventorZequn Mei
Life of this patent
Estimating the term…
Abstract
Solder compositions, solder pastes and methods of manufacturing thereof having a solder material coated with a coating material by an immersion coating process or an electroless plating process. The solder composition and solder pastes are substantially lead-free and have melting temperatures approaching those of traditional tin-lead solders.
Claims18
A solder composition comprising:
- a substantially lead-free solder material comprising tin and zinc;
- and
- an immersion coating material consisting essentially of one of tin and a tin alloy, and having a thickness between 0.5 and 0.83 microns disposed about said solder material such that said solder material melts said coating material from within the solder composition during use.
A method of making a coated solder composition comprising the steps of
- providing a solder material comprising tin and zinc and;
- coating said solder material with 0.5 to 0.83 microns of a coating material consisting essentially of one of tin and a tin alloy by a process selected from the group consisting of immersion coating and electroless plating.
A method of making a coated lead-free solder comprising:
- providing eutectic 91Zn-9Sn solder powder, and
- coating said solder powder with a tin layer having a thickness between 0.5 and 0.83 microns by a process selected from the group consisting of immersion coating and electroless plating.
Dependencies are inferred from the claim text.