Low toxicity alloy compositions for joining and sealing
AssigneeCookson Group PLC
InventorsKay L. Tucker, Ulysses Ma
Life of this patent
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Abstract
A lead-free alloy for joining and sealing which is useful as a plumbing solder comprises from 0.08 to 20% by weight of bismuth, from 0.02 to 1.5% by weight of copper, from 0.01 to 1.5% by weight of silver, from 0 to 0.10 percent by weight of phosphorus, from 0 to 0.20% of a rare earth mixture and the balance tin, together with incidental impurities. The alloy has a similar pasty range (i.e. melting temperature and melting range) to the traditional tin-lead plumbing solders.
Claims11
A low toxicity alloy composition for joining and sealing consisting essentially of from 0.08 to 20% by weight of bismuth, from 0.02 to 1.5% by weight of copper, from 0.01 to 1.5% by weight of silver, from 0 to 0.10% by weight of phosphorus, from 0 to 0.02% by weight of a rare earth mixture consisting of a mixture of 53% cerium, 24% lanthanum, 16% neodymium and 5% praesedymium, no more than 0.01% by weight antimony and the balance tin, together with incidental impurities.
A lead-free plumbing solder which consists essentially of 0.08 to 20% by weight bismuth, 0.02 to 1.5% by weight copper, 0.01 to 1.5% silver, no more than 0.01% by weight antimony and a balance of tin, and incidental impurities.
Dependencies are inferred from the claim text.