B23K 26/38
By boring or cutting
Official title: by boring or cutting
B23K26/38 (By boring or cutting) appears on 3,300 US grants and 4,528 published applications in this corpus.
Search patents in B23K- Granted patents
- 3,300
- Published applications
- 4,528
- Assignees
- 1,638
- Inventors
- 8,165
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 7 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 8 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 7 | 0 |
| 1986 | 2 | 0 |
| 1987 | 8 | 0 |
| 1988 | 4 | 0 |
| 1989 | 14 | 0 |
| 1990 | 15 | 0 |
| 1991 | 19 | 0 |
| 1992 | 16 | 0 |
| 1993 | 17 | 0 |
| 1994 | 10 | 0 |
| 1995 | 13 | 0 |
| 1996 | 18 | 0 |
| 1997 | 25 | 0 |
| 1998 | 31 | 0 |
| 1999 | 27 | 0 |
| 2000 | 34 | 0 |
| 2001 | 57 | 32 |
| 2002 | 68 | 65 |
| 2003 | 80 | 99 |
| 2004 | 79 | 88 |
| 2005 | 41 | 87 |
| 2006 | 33 | 105 |
| 2007 | 31 | 84 |
| 2008 | 35 | 109 |
| 2009 | 33 | 102 |
| 2010 | 66 | 126 |
| 2011 | 56 | 96 |
| 2012 | 88 | 97 |
| 2013 | 93 | 173 |
| 2014 | 124 | 196 |
| 2015 | 124 | 200 |
| 2016 | 138 | 243 |
| 2017 | 153 | 225 |
| 2018 | 139 | 262 |
| 2019 | 232 | 335 |
| 2020 | 222 | 269 |
| 2021 | 215 | 288 |
| 2022 | 203 | 278 |
| 2023 | 170 | 273 |
| 2024 | 217 | 250 |
| 2025 | 190 | 253 |
| 2026 | 124 | 193 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Laser machining apparatus6 Oct 2026US 12,752,369 B2Mitsubishi Electric Corporation
- Processing apparatus6 Oct 2026US 12,752,375 B2Disco Corporation
- Laser blanking device6 Oct 2026US 12,752,376 B2Komatsu Industries Corporation
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using a method of this type6 Oct 2026US 12,752,377 B2Rogers Germany GmbH
- Methods and apparatus for additively manufactured endoskeleton-based transport structures29 Sep 2026US 12,746,706 B2Divergent Technologies, Inc.
- Laser machining system for a timepiece component and laser machining process8 Oct 2026US 2026/0307169 A1Rolex SA
- Laser machining system for a component and laser machining process8 Oct 2026US 2026/0307175 A1Alphanov
- Plasma diced wafers and methods thereof8 Oct 2026US 2026/0314321 A1UTAC Headquarters Pte. Ltd.
- Semiconductor Device and Method of Forming Channels in Encapsulant to Reduce Warpage in Reconstituted Wafer8 Oct 2026US 2026/0314472 A1STATS ChipPAC Pte. Ltd.
- Laser cutting installation1 Oct 2026US 2026/0295726 A1Fagor Arrasate, S. Coop.
Most cited
By later US patents
- Rotary drive shaft assemblies for surgical instruments with articulatable end effectors1,997US 8,747,238 B2Ethicon Endo-Surgery, Inc. · 2014
- Process for forming outlet passageways in pills using a laser548US 4,088,864 AAlza Corporation · 1978
- Apparatus for tracking moving workpiece by a laser beam491US 4,063,064 ACoherent Radiation · 1977
- Method for controlling configuration of laser induced breakdown and ablation454US 5,656,186 AThe Regents of the University of Michigan · 1997
- Laser-produced porous surface342US 7,537,664 B2Howmedica Osteonics Corp. · 2009