Laser machining apparatus
AssigneeMitsubishi Electric Corporation
InventorsKyohei Ishikawa, Masaki Seguchi, Motoaki Nishiwaki, Kenta Fujii, Tomotaka Katsura
Life of this patent
Estimating the term…
Loading patent…
AssigneeMitsubishi Electric Corporation
InventorsKyohei Ishikawa, Masaki Seguchi, Motoaki Nishiwaki, Kenta Fujii, Tomotaka Katsura
Estimating the term…
A laser machining apparatus includes an actuator that changes relative positions of a machining head and a workpiece; a control unit that controls in machining execution the laser oscillator, the machining head, and the actuator based on a machining parameter; a machining state observation unit that detects, from process light that is light generated from the workpiece by laser beam irradiation, light intensities in a plurality of predetermined wavelength bands as a plurality of optical sensor signals; a feature extraction unit that extracts at least one of features, the features being obtainable from an index of correlation between the plurality of optical sensor signals and from one of the optical sensor signals; and a correction quantity calculation unit that determines the machining parameter to be corrected as a correction parameter and a correction quantity for the correction parameter based on the at least one of the features.
A laser machining apparatus comprising:
A laser machining apparatus comprising:
Dependencies are inferred from the claim text.