B23K 2103/18
Dissimilar materials
B23K2103/18 (Dissimilar materials) appears on 1,770 US grants and 2,453 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,770
- Published applications
- 2,453
- Assignees
- 1,013
- Inventors
- 5,140
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 5 | 0 |
| 1988 | 8 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 8 | 0 |
| 1994 | 8 | 0 |
| 1995 | 4 | 0 |
| 1996 | 7 | 0 |
| 1997 | 15 | 0 |
| 1998 | 13 | 0 |
| 1999 | 8 | 0 |
| 2000 | 18 | 0 |
| 2001 | 18 | 5 |
| 2002 | 13 | 16 |
| 2003 | 22 | 31 |
| 2004 | 26 | 36 |
| 2005 | 19 | 44 |
| 2006 | 15 | 44 |
| 2007 | 13 | 49 |
| 2008 | 12 | 46 |
| 2009 | 13 | 59 |
| 2010 | 28 | 91 |
| 2011 | 40 | 87 |
| 2012 | 42 | 88 |
| 2013 | 59 | 103 |
| 2014 | 59 | 97 |
| 2015 | 77 | 133 |
| 2016 | 82 | 214 |
| 2017 | 100 | 193 |
| 2018 | 118 | 155 |
| 2019 | 143 | 173 |
| 2020 | 141 | 167 |
| 2021 | 115 | 147 |
| 2022 | 131 | 160 |
| 2023 | 104 | 110 |
| 2024 | 120 | 111 |
| 2025 | 89 | 60 |
| 2026 | 49 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Solder and electronic component22 Sep 2026US 12,741,343 B2TDK Corporation
- Method and automatic brazing apparatus for flame brazing control in copper-aluminum welding15 Sep 2026US 12,734,599 B2Shaoxing Daishin Xinrui Brazing Equipment Co., Ltd.
- Dissimilar material solid phase bonding method, and dissimilar material solid phase bonded structure15 Sep 2026US 12,734,603 B2The University of Osaka
- Deposition head for friction stir additive manufacturing devices and methods15 Sep 2026US 12,734,604 B2Blue Origin Manufacturing, LLC
- Fabrication of high-strength and lightweight beams and structures1 Sep 2026US 12,722,233 B2Tokyo Electron Limited
- Method for joining dissimilar materials of titanium metal and solder for vacuum vessel sealing1 Oct 2026US 2026/0295703 A1Shijiazhuang Tiedao University
- Semiconductor device substrate and method for producing semiconductor device substrate24 Sep 2026US 2026/0293676 A1NGK Insulators, Ltd.
- Laser welding of optical fibers to substrates17 Sep 2026US 2026/0273662 A1Corning Research & Development Corporation
- Al-fe-alloy plated steel sheet for hot forming, having excellent twb welding characteristics, hot forming member, and manufacturing methods therefor17 Sep 2026US 2026/0275473 A1Posco
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248008 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- Forming structures from CAD solid models580US 6,391,251 B1Optomec Design Company · 2002
- Porous stent drug delivery system529US 5,972,027 ASciMed Life Systems, Inc. · 1999
- Laser production of articles from powders454US 5,837,960 AThe Regents of the University of California · 1998
- Laser-produced porous surface342US 7,537,664 B2Howmedica Osteonics Corp. · 2009
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019