Dissimilar material solid phase bonding method, and dissimilar material solid phase bonded structure

Abstract

The present invention provides dissimilar material solid phase bonding with which a robust bonded portion of metal materials having different compositions can be formed efficiently. The present invention also provides a dissimilar material solid phase bonded structure having a dissimilar material solid phase bonded portion in which metal materials having different compositions have been bonded together robustly. In the dissimilar material solid phase bonding method according to the present invention, one member is brought into contact with another member to form an interface to be bonded, and newly formed surfaces of the one member and the other member are formed at the interface to be bonded, by means of the application of a bonding load, characterized in that: the one member and the other member have different compositions; the temperature at which the one member and the other member have substantially the same strength is defined as a bonding temperature; and the bonding load at which strength is applied substantially perpendicular to the interface to be bonded is set.

Dependencies are inferred from the claim text.