Suss Microtec Inc
Garching, DE· latest recorded location
SUSS MICROTEC INC is named on 5 US grants and 7 published applications in this corpus. Its most frequent classification is B23K (Soldering or unsoldering).
- Granted patents
- 5
- Published applications
- 7
- Inventors
- 13
- Granted in 2026 so far
- 0
- Most recent grant
- 7 Aug 2012
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 5 |
| 2009 | 0 | 1 |
| 2010 | 3 | 0 |
| 2011 | 0 | 0 |
| 2012 | 2 | 1 |
By publication year.
Technology areas
Share of 12 documents
- B23KSoldering or unsoldering11
- H05KPrinted circuits11
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by11
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered3
- Y10TTechnical subjects covered by former us classification3
Recent patents
- Removing material from defective opening in glass mold7 Aug 2012US 8,237,086 B2
- Apparatus and method for semiconductor wafer bumping via injection molded solder3 Jan 2012US 8,088,684 B2
- Apparatus and method for semiconductor wafer bumping via injection molded solder7 Sep 2010US 7,790,596 B2
- Apparatus and method for semiconductor wafer bumping via injection molded solder8 Jun 2010US 7,732,320 B2
- Apparatus and method for semiconductor wafer bumping via injection molded solder27 Apr 2010US 7,703,658 B2
- Removing material from defective opening in glass mold27 Sep 2012US 2012/0241116 A1
- Removing material from defective opening in glass mold and related glass mold for injection molded solder16 Jul 2009US 2009/0179020 A1
- Apparatus and method for in-situ monitoring of wafer bonding time20 Nov 2008US 2008/0285059 A1
- Apparatus and method for semiconductor wafer bumping via injection molded solder2 Oct 2008US 2008/0237315 A1
- Apparatus and method for semiconductor wafer bumping via injection molded solder7 Aug 2008US 2008/0188069 A1
Most cited
By later US patents
- Apparatus and method for semiconductor wafer bumping via injection molded solder3US 7,703,658 B22010
- Apparatus and method for semiconductor wafer bumping via injection molded solder3US 7,732,320 B22010
- Removing material from defective opening in glass mold2US 8,237,086 B22012
- Apparatus and method for semiconductor wafer bumping via injection molded solder1US 7,790,596 B22010