Apparatus and method for semiconductor wafer bumping via injection molded solder

An apparatus for forming solder bumps onto semiconductor structures comprising:

• equipment for filling patterned mold cavities formed on a surface of a mold structure with solder, said equipment comprising an injector head assembly comprising a solder reservoir having a bottom surface with an elongated slot for injecting solder into said mold cavities and a carriage assembly configured to carry and scan said mold structure under said injector head assembly, wherein said carriage assembly comprises first and second parallel rails, a plate assembly movable upon said first and second parallel rails, a start parking space and a finish parking space and wherein said mold structure is placed upon said movable plate assembly for performing said scanning under said injector head assembly, and wherein each of said parking spaces comprises a parking plate having a V-groove on its bottom surface, a heated base supporting said parking plate, an insulator plate supporting said heated base, a back plate supporting said insulator plate and first and second leveling plates configured to level said back plate;
• and wherein said mold structure is brought into contact with said solder reservoir bottom surface and said elongated slot and a seal is formed between an area of said solder reservoir bottom surface surrounding said elongated slot and said mold structure surface and then said mold cavities are filled with solder by scanning said mold structure under said injector head in a first direction from a starting position to a finish position while solder is injected into them and then said mold structure with the filled mold cavities is returned back to said starting position by scanning in a second direction opposite to said first direction without any further solder injection;
• equipment for positioning and aligning a patterned first surface of a semiconductor structure directly opposite to said solder filled patterned mold cavities of the mold structure;
• a fixture tool for holding and transferring said aligned mold and semiconductor structures together;
• and
• equipment for receiving said fixture tool with the aligned mold and semiconductor structures and transferring the solder from said aligned patterned mold cavities to said aligned patterned semiconductor first surface.