Apparatus and method for semiconductor wafer bumping via injection molded solder

An apparatus for forming solder bumps onto semiconductor structures comprising:

• equipment for filling patterned mold cavities formed on a first surface of a mold structure with solder;
• equipment for positioning and aligning a patterned first surface of a semiconductor structure directly opposite to said solder filled patterned mold cavities of the mold structure;
• a fixture tool for holding and transferring said aligned mold and semiconductor structures together, wherein said fixture tool comprises a frame having a central aperture, a substrate dimensioned to be supported within said central aperture and one or more clamp and spacer assemblies arranged symmetrically around said frame, and wherein said substrate is brought in contact with a second surface of said semiconductor structure wherein said second surface is opposite to the first surface and wherein each clamp and spacer assembly comprises a clamp configured to clamp said mold and semiconductor structures together and a spacer configured to be inserted between said first surface of said semiconductor structure and said first surface of said mold structure and thereby to separate said mold and semiconductor structures by a distance equal to said spacer's height;
• equipment for receiving said fixture tool with the aligned mold and semiconductor structures and transferring the solder from said aligned patterned mold cavities to said aligned patterned semiconductor first surface;
• and
• wherein said mold cavities pattern matches said semiconductor surface pattern.