Apparatus and method for semiconductor wafer bumping via injection molded solder

A method for forming solder bumps onto semiconductor structures comprising:

• filling patterned mold cavities formed on a first surface of a mold structure with solder;
• positioning and aligning a patterned first surface of a semiconductor structure directly opposite to said solder filled patterned mold cavities of the mold structure wherein said aligning comprises
• aligning at least one motorized alignment pin with a first fiduciary marker on said mold structure and with a first fiduciary marker on said semiconductor structure;
• and
• performing a pattern based alignment comprising identifying a mold training pattern image and a semiconductor training pattern image on a training mold structure and a training semiconductor structure, respectively, training said alignment tool with said training pattern images, storing said alignment tool trained position, identifying a mold pattern image and a semiconductor pattern image on said mold structure and said semiconductor structure matching said mold training pattern image and said semiconductor training pattern image, respectively, and aligning said identified mold pattern image with said identified semiconductor pattern image;
• providing a fixture tool for holding and transferring said aligned mold and semiconductor structures together;
• and
• inserting said fixture tool with the aligned mold and semiconductor structures into solder transfer equipment and transferring the solder from said aligned patterned mold cavities to said aligned patterned semiconductor first surface.