Scientech Corporation
TAIPEI CITY, TW· latest recorded location
SCIENTECH CORPORATION is named on 5 US grants and 5 published applications in this corpus. Its most frequent classification is H10P (Generic processes or apparatus for the manufacture or treatment of devices covered).
- Granted patents
- 5
- Published applications
- 5
- Inventors
- 9
- Granted in 2026 so far
- 0
- Most recent grant
- 26 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 2 | 1 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 10 documents
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered8
- B05BSpraying apparatus2
- B05CApparatus for applying fluent materials to surfaces, in general2
- B08BCleaning in general2
- F16KValves2
- B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging1
- F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange1
- G06FComputing and data processing1
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by1
Recent patents
- Liquid injection device26 Aug 2025US 12,397,311 B2
- Wafer processing method and carrier3 Dec 2024US 12,159,794 B2
- Wafer transfer device and wafer transfer method of semiconductor manufacturing process3 Sep 2024US 12,080,579 B1
- Substrate processing system24 Aug 2021US 11,101,157 B2
- Flat plate heat pipe cooling system for electronic equipment enclosure21 Nov 2000US 6,148,906 A
- Diaphragm type substrate processing device25 Jun 2026US 2026/0175368 A1
- Liquid injection device18 Jul 2024US 2024/0238823 A1
- Wafer processing method and carrier16 Mar 2023US 2023/0079627 A1
- Substrate processing system23 Apr 2020US 2020/0126831 A1
- Non-Contact Substrate Chuck and Vertical Type Substrate Supporting Apparatus Using the Same20 Feb 2014US 2014/0048994 A1
Most cited
By later US patents