Murata Electronics Oy
Vantaa, FI· latest recorded location
MURATA ELECTRONICS OY is named on 18 US grants and 10 published applications in this corpus. Its most frequent classification is G01C (Measuring distances, levels or bearings).
- Granted patents
- 18
- Published applications
- 10
- Inventors
- 24
- Granted in 2026 so far
- 0
- Most recent grant
- 28 Nov 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 1 | 0 |
| 2013 | 2 | 3 |
| 2014 | 5 | 5 |
| 2015 | 3 | 1 |
| 2016 | 4 | 1 |
| 2017 | 3 | 0 |
By publication year.
Technology areas
Share of 28 documents
- G01CMeasuring distances, levels or bearings15
- G01PMeasuring linear or angular speed, acceleration, deceleration, or shock12
- B81BMicrostructural devices or systems5
- B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural5
- G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure5
- H02NElectric machines not otherwise provided for5
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by5
- Y10TTechnical subjects covered by former us classification5
- H10FSolar cells and light sensors4
- H10NElectric solid-state devices not otherwise provided for4
Recent patents
- Method of making a system-in-package device, and a system-in-package device28 Nov 2017US 9,828,239 B2
- Acceleration sensor structure and use thereof16 May 2017US 9,651,574 B2
- Power collector structure and method9 May 2017US 9,647,577 B2
- Method and device for measuring the progress of a moving person13 Dec 2016US 9,518,828 B2
- Pointing method, a device and system for the same21 Jun 2016US 9,372,549 B2
- Acceleration sensor structure and use thereof11 Feb 2016US 2016/0041194 A1
- Method of making a system-in-package device, and a system-in-package device31 Dec 2015US 2015/0375996 A1
- Microelectromechanical resonator20 Nov 2014US 2014/0339963 A1
- Method of making a system-in-package device, and a system-in-package device7 Aug 2014US 2014/0217615 A1
- Vibratory gyroscope2 Jan 2014US 2014/0000365 A1
Most cited
By later US patents
- Method for measuring angular velocity and a vibrating micromechanical sensor of angular velocity8US 8,474,316 B22013
- Method for manufacturing a microelectromechanical component; and a microelectromechanical component6US 8,450,816 B22013
- Energy harvesting/tire pressure, temperature and tire data transmitter5US 8,878,421 B22014
- Acceleration sensor structure and use thereof4US 9,279,825 B22016
- Micromechanical resonator3US 8,334,736 B22012