US 2014/0339963 A1 · MICROELECTROMECHANICAL RESONATOR

Abstract

A method for manufacturing microelectromechanical flexural resonators with a deforming element that has an elongate body extending along a spring axis. A deforming element is positioned on the semiconductor wafer with a defined nominal n-type doping concentration such that a crystal orientation angle is formed between the spring axis of the deforming element and a crystal axis of the silicon semiconductor wafer. The combination of the crystal orientation angle and the nominal n-type doping concentration is adjusted to a specific range, based on total frequency error of the deforming element in a broad temperature range. The combination is optimized to a range where also sensitivity to variations in the material properties is minimized.

Claims12

Dependent claims

A method for manufacturing microelectromechanical resonators, wherein a microelectromechanical resonator comprises a deforming element with an elongate body that extends along a spring axis, and the method comprises:

providing a semiconductor wafer, a plane of which is aligned to a crystal plane of a semiconductor crystal and has a nominal n-type doping concentration;
positioning the deforming element on the semiconductor wafer such that a crystal orientation angle is formed between the spring axis of the deforming element and a <100> crystal axis of the semiconductor crystal lattice;
determining, for the crystal orientation angle and the nominal n-type doping concentration, a value for total frequency error of the deforming element in a defined temperature range;
and
using the crystal orientation angle in the manufacturing if the value for total frequency error of the deforming element in the defined temperature range remains below a predefined error threshold value.

2 more elements

Dependencies are inferred from the claim text.

Microelectromechanical resonator

Life of this patent

Microelectromechanical resonator

Life of this patent

Abstract

Claims12