E&R Engineering Corporation
KAOHSIUNG CITY, TW· latest recorded location
E&R ENGINEERING CORPORATION is named on 4 US grants and 12 published applications in this corpus. Its most frequent classification is B23K (Soldering or unsoldering).
- Granted patents
- 4
- Published applications
- 12
- Inventors
- 6
- Granted in 2026 so far
- 0
- Most recent grant
- 29 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2017 | 0 | 2 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 2 |
| 2022 | 1 | 0 |
| 2023 | 0 | 2 |
| 2024 | 1 | 1 |
| 2025 | 0 | 0 |
| 2026 | 0 | 4 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 16 documents
- B23KSoldering or unsoldering7
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered7
- G02BOptical elements, systems or apparatus4
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by3
- B25JManipulators2
- C03CChemical composition of glasses, glazes or vitreous enamels2
- G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure2
- B41JTypewriters1
- C25DProcesses for the electrolytic or electrophoretic production of coatings1
Recent patents
- Laser processing device for forming vias29 Oct 2024US 12,130,427 B2
- Load port21 Jun 2022US 11,367,638 B2
- Transport mechanism for wafers of different sizes and types30 Nov 2021US 11,189,513 B1
- Wafer leveling device11 Jun 2019US 10,319,614 B2
- Manufacturing method for multilayer structure with through glass vias for packaging16 Jul 2026US 2026/0206610 A1
- Method for fabricating glass interposer with through glass via16 Jul 2026US 2026/0206611 A1
- Laser direction guiding assembly and laser processing device having the same23 Apr 2026US 2026/0108980 A1
- Control method for laser processing machine16 Apr 2026US 2026/0102847 A1
- Laser processing apparatus and processing method thereof17 Oct 2024US 2024/0342829 A1
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.