Wafer leveling device

A wafer leveling device, comprising:

• a carrier module (10) with a claw component (11) having a plurality of claw structures (111) vertically stacked on top of a ring-shaped base component (12);
• a fixture module (20) comprising a ring component (21) having a ring shape which is vertically stacked on the claw component (11), and a clamp component (22) vertically stacked on top of the ring component (21);
• the clamp component (22) releasably attached to the ring component (21), a dynamic module (30) which lifts the claw component (11) to reach an up position and lowers the claw component (11) to reach a down position, wherein the dynamic module (30) comprises at least one driving motor component (35), a curved stabilizing component (31) below the claw component (11), at least one right-angle mounting component (32) extending perpendicular to at least one vertical movement component (33) and at least one vertical track component (34), the claw component (11) and the curved stabilizing component (31) having at least one aligned slot aligned with and receiving the at least one right-angle mounting component (32), wherein:
• edges of the claw structures (111) contact a bottom surface of the wafer (40) when the claw component (11) is lifted to the up position by the dynamic module (30) after the wafer (40) has been conveyed to and held above the claw component (11) by a robotic arm, the ring component (21) contacts a rim of an upper surface of the wafer (40) after the claw component (11) is lifted to the up position by the dynamic module (30) and the clamp components (22) release the ring component (21), the claw component (11), the ring component (21) and the wafer (40), all of which keep stabilized mutual positions, are lowered to the down position in which several protrudent structures (121) on the base component (12) contact a rim of the bottom surface of the wafer (40), after which the wafer (40) undergoes a manufacturing process, the claw component (11) , the ring component (21) and the wafer (40) are lifted to the up position after the wafer (40) completes the manufacturing process, and the carrier module (10) and the wafer (40) are then lowered while the clamp components (22) hold the ring component (21) in the up position to enable removal of the wafer (40) by the robotic arm, wherein the fixture module (20) comprises a vacuum component (23).