Die Tech, Inc.
York Haven, PA, US· latest recorded location
Die Tech, Inc. is named on 9 US grants and 0 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 9
- Published applications
- 0
- Inventors
- 6
- Granted in 2026 so far
- 0
- Most recent grant
- 17 Jul 2001
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
By publication year.
Technology areas
Share of 9 documents
- H05KPrinted circuits7
- Y10TTechnical subjects covered by former us classification5
- H01RElectrically-conductive connections4
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by3
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered2
- B28DWorking stone or stone-like materials1
Recent patents
- Edge clip terminal17 Jul 2001US 6,261,136 B1
- Solder terminal strip2 May 1995US 5,411,420 A
- Substrate lead strip mounting machine and method2 Aug 1994US 5,333,375 A
- Method of making an integrated circuit substrate lead assembly19 Oct 1993US 5,253,415 A
- Method of mounting lead frame on substrate11 Aug 1992US 5,136,779 A
No published applications.
Most cited
By later US patents