Method of mounting lead frame on substrate
AssigneeDie Tech, Inc.
InventorsBaron E. Abel, David L. Archer
Life of this patent
Estimating the term…
Abstract
A lead frame for orienting and then mounting a plurality of clip leads on a semi-conductor device or substrate and method.
Claims9
The method of mounting a lead on a substrate, the substrate having top and bottom surfaces and edge corners and the lead having a clip with first and second arms, a first contact on the first arm and a substrate support on the second arm, comprising the steps of:
- a) relatively positioning the clip adjacent an edge of the substrate with the arms facing the edge, the first contact to one side of the substrate edge and the bottom of the substrate resting on the substrate support;
- b) relatively rotating the clip toward the substrate to freely move the first contact over the corner at the top of the substrate without engaging the corner and then above the substrate, while maintaining the substrate on the support;
- and
- c) further rotating the clip relative to the substrate to move the first contact into engagement with the top surface of the substrate inwardly of the substrate corner.
The method of mounting a substrate having spaced opposed substrate corners onto individual leads, each lead being integrally connected to an essentially flat lead frame unit by a carrier strip to form two like, opposed rows of similarly mounted leads forming the opposite sides of a central opening in the lead frame unit, the leads each having an inwardly facing clip comprising first and second arms with first contacts on the first arms and substrate supports on the second arms, comprising the steps of:
- a) locating the clips to one side of the lead frame unit with the substrate supports in the two rows being located more closely together than the first arms;
- b) placing a substrate on the substrate supports and moving the substrate toward the lead unit while rotating the clips onto the substrate;
- and
- c) moving the first contacts freely over the corners of the substrate, inwardly of the substrate corners and then into engagement with the top surface of the substrate.
Dependencies are inferred from the claim text.