Method of making an integrated circuit substrate lead assembly
AssigneeDie Tech, Inc.
InventorRichard K. Dennis
Life of this patent
Estimating the term…
Abstract
A lead assembly and method for forming electrical connections between pads on an integrated circuit chip and pads on a circuit board includes small diameter wires adhesively bonded to a supporting tape. The wires may be inwardly fanned to form connections between relatively widely spaced circuit board pads and relatively closely spaced chip pads.
Claims19
The method of manufacturing a lead assembly for forming electrical connections between contact pads on a board and closely spaced contact pads on an integrated circuit chip comprising the steps of:
- a. stringing a plurality of individual conductive wire filaments in generally parallel side-by-side relation to form an array of parallel filaments remote from the tape segments;
- b. providing first and second tape segments remote from the array of parallel conductive wire filaments;
- c. adhering portions of the filament array to the first and second tape segments so that each segment carries an array of generally parallel wire filaments extending across the segment;
- d. positioning one segment on top of the other segment with the filaments in the respective arrays on the segments oriented at approximately 90 degrees to each other and adhering the two tape segments to each other;
- and
- f. forming a series of chip contact ends on the filaments of each segment array, such ends being located at a chip location on the tape segments and forming board contact ends on the filaments of each segment array, such ends being located away from the chip location.
The method of manufacturing a lead assembly for forming electrical connections between contact pads on a board and closely spaced contact pads on an integrated circuit chip using cylindrical wire filaments comprising the steps of:
- a. adhering two side-by-side arrays of generally parallel conductive cylindrical wire filaments oriented generally perpendicular to each other to a tape segment with central portions of said filament arrays intersecting each other at a chip location;
- and
- b. removing the intersecting portions of the filament arrays and the adhered portion of the tape segment at the chip location to form at least of pair of generally perpendicular arrays of individual filaments having chip contact ends adjacent the chip location and board contact pads located away from the chip location.
The method of manufacturing a lead assembly for forming electrical connections between contact pads on a board and closely spaced contact pads on an integrated circuit chip comprising the steps of adhering two arrays of side-by-side and inwardly fanned conductive cylindrical wire filaments having a diameter of about 0.001 to 0.003 inch to a tape segment to either side of a chip location with each array including a row of board contact ends exposed through the thickness of the tape segment away from the chip location and a row of chip contact ends exposed through the thickness of the tape segment adjacent to the chip location with the filaments in each array being inwardly fanned between the board contact ends and the chip contact ends so that the chip contact ends are spaced more closely together than the board contact ends;
- and removing portions of the tape carrier at such ends.
Dependencies are inferred from the claim text.