Solder terminal
AssigneeDie Tech, Inc.
InventorRichard K. Dennis
Life of this patent
Estimating the term…
Abstract
A solder terminal includes a clip adapted to be positioned on one edge of a substrate for forming soldered electrical connections with substrate pads. One end of the clip extends away from the substrate for making an electrical connection with a circuit component.
Claims17
A solder terminal including a contact element and a first arm joined to the element, the arm having a flat base with opposed edges, and in integral solder mass comprising a thin flat solder layer integrally bonded to the base and a pair of solder reservoirs extending along the edges of the base and joined to the thin solder layer only.
A solder terminal including a contact for establishing an electrical connection with circuit elements and a clip at one end of the contact, said clip including first and second opposed contact arms and a bridge joining said arms, the interior surface of one arm including a flat base facing the other arm, the interior surface of the other arm including a transverse contact ridge facing the one arm, and an integral solder mass including a thin U-shape solder layer extending around and bonded to the interior surfaces of the clip arms and bridge and overlying the flat base and the contact ridge and a pair of U-shaped solder reservoirs located at the lateral strip edges and joined to the edges of the thin solder layer only.
The method of manufacturing a solder terminal having a solder coated contact with integral solder reservoirs including the steps of:
- a. bonding a solder body to a portion of a terminal strip having side edges;
- and
- b. coining the solder body to reduce the thickness of the solder overlying the strip, form a thin solder strip and extrude such solder laterally past both edges of the strip and form large volume solder reservoirs extending along the edges of the strip.
Dependencies are inferred from the claim text.