CCS Technology, Inc.
Taoyuan, TW· latest recorded location
CCS Technology, Inc. is named on 5 US grants and 6 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 5
- Published applications
- 6
- Inventors
- 3
- Granted in 2026 so far
- 0
- Most recent grant
- 8 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2022 | 2 | 5 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
| 2025 | 2 | 0 |
By publication year.
Technology areas
Share of 11 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by11
- H05KPrinted circuits6
- H10HInorganic light-emitting semiconductor devices having potential barriers3
- B65GTransport or storage devices2
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered2
- G09FDisplaying1
- H10DInorganic electric semiconductor devices1
Recent patents
- 3D package configuration8 Jul 2025US 12,354,942 B2
- 3D package configuration18 Mar 2025US 12,255,180 B2
- 3D package configuration3 Dec 2024US 12,159,824 B2
- 3D package configuration28 Jun 2022US 11,373,983 B1
- Apparatus for transferring microdevice and method for transferring microdevice22 Feb 2022US 11,257,695 B1
- Tiled display and manufacturing method thereof12 Sep 2024US 2024/0304120 A1
- 3d package configuration23 Jun 2022US 2022/0199497 A1
- 3d package configuration23 Jun 2022US 2022/0199498 A1
- 3d package configuration23 Jun 2022US 2022/0199579 A1
- 3d package configuration23 Jun 2022US 2022/0199583 A1
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.