3D package configuration
AssigneeCCS Technology, Inc.
InventorsTung-Po Sung, Chang-Cheng Lo
Life of this patent
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Abstract
A novel 3D package configuration is provided by stacking a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.
Claims10
A 3D package configuration, comprising:
- a package substrate;
- and
- a folded flexible circuit board structure vertically stacked on the package substrate and electrically connected therewith, comprising:
- a folded flexible circuit board formed by folding a strip-shaped flexible circuit board including a strip-shaped first flexible circuit board joined with a strip-shaped second flexible circuit board, wherein the strip-shaped first flexible circuit board comprises a first surface with a first die bonding zone and at least one second die bonding zone formed thereon and a second surface opposite to each other, and the strip-shaped second flexible circuit board comprises a third surface with at least one third die bonding zone formed thereon and a fourth surface opposite to each other, and a plurality of package substrate bonding pads corresponding to the first die bonding zone and electrically connected therewith are formed on the third surface of the second flexible circuit board;
- at least one first semiconductor die bonded to the first die bonding zone and electrically connected to the first flexible circuit board;
- at least one second semiconductor die bonded to the at least one second die bonding zone and electrically connected to the first flexible circuit board;
- and
- at least one third semiconductor die bonded to the at least one third die bonding zone and electrically connected to the second flexible circuit board;
- wherein, the at least one third semiconductor die and the at least one second semiconductor die are alternatively vertically stacked above the at least one first semiconductor die, and the folded flexible circuit board structure is electrically connected with the package substrate through the package substrate bonding pads.
Dependencies are inferred from the claim text.