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US 2022/0199579 A1Published application
3d package configuration
AssigneeCCS Technology, Inc.
InventorsTung-Po Sung, Chang-Cheng Lo
Life of this patent
Estimating the term…
Abstract
A novel 3D package configuration is provided by stacking a plurality of semiconductor package units or a folded flexible circuit board structure on a lead frame and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.
Claims29
A 3D package configuration, comprising:
- a lead frame;
- and
- a plurality of semiconductor package units vertically stacked on the lead frame in sequence, wherein the semiconductor package units are electrically connected to each other and electrically connected therewith, and each of the semiconductor package units comprises:
- a semiconductor die with a top surface and a bottom surface opposite to each other, and a plurality of side surfaces adjacent to the top surface and the bottom surface;
- and
- a folded flexible circuit board with a first surface and a second surface opposite to each other, wherein the bottom surface of the semiconductor die is bonded to the first surface and electrically connected to the folded flexible circuit board, and the first surface of the folded flexible circuit board is attached onto the top surface, the bottom surface and one of the side surfaces of the semiconductor die;
- wherein the folded flexible circuit board comprises:
- a flexible insulating substrate;
- a circuit formed on a surface of the flexible insulating substrate;
- and
- an insulating layer overlaying the circuit
- wherein, the first surface of the folded flexible circuit board comprises a plurality of first bonding pads electrically connected to the circuit, and the bottom surface of the semiconductor die is bonded to the first surface and electrically connected to the folded flexible circuit board through the first bonding pads, and the second surface and the flexible insulating substrate of the folded flexible circuit board corresponding to the top surface of the semiconductor die respectively comprise a plurality of second bonding pads and a plurality of first conductive holes electrically connected to the circuit, and the second surface and the flexible insulating substrate of the folded flexible circuit board corresponding to the bottom surface of the semiconductor die respectively comprise a plurality of third bonding pads and a plurality of second conductive holes electrically connected to the circuit, and each of the third bonding pads is electrically connected to the circuit through one of the second conductive holes;
- wherein, the semiconductor package units are vertically and sequentially stacked to interconnect with each other by bonding the third bonding pads of one of the semiconductor package unit to the second bonding pads of another adjacent one of the semiconductor package units, and the bottommost one of the semiconductor package units is directly bonded to the lead frame and electrically connected therewith through the third bonding pads.
10 more elements
(canceled)
A 3D package configuration, comprising:
- a lead frame;
- and
- a folded flexible circuit board structure vertically stacked on the lead frame and electrically connected therewith, comprising:
- a flexible circuit board with a first surface and a second surface opposite to each other, wherein the flexible circuit board having a first die bonding zone formed on the first surface and at least one second die bonding zone formed on the first surface and/or the second surface;
- at least one first semiconductor die bonded to the first die bonding zone and electrically connected to the flexible circuit board;
- and
- at least one second semiconductor die bonded to the at least one second die bonding zone and electrically connected to the flexible circuit board;
- wherein, the at least one second semiconductor die is vertically stacked above the at least one first semiconductor die by folding the flexible circuit board to form the folded flexible circuit board structure vertically stacked on the lead frame and electrically connected therewith through lead frame bonding pads.
5 more elements
A 3D package configuration, comprising:
- a lead frame;
- and
- a folded flexible circuit board structure vertically stacked on the lead frame and electrically connected therewith, comprising:
- a first flexible circuit board with a first surface and a second surface opposite to each other, wherein the first flexible circuit board includes a first die bonding zone and at least one second die bonding zone formed on the first surface;
- at least one first semiconductor die bonded to the first die bonding zone and electrically connected to the first flexible circuit board;
- at least one second semiconductor die bonded to the at least one second die bonding zone and electrically connected to the first flexible circuit board;
- a second flexible circuit board with a third surface and a fourth surface opposite to each other, wherein the second flexible circuit board includes at least one third die bonding zone formed on the third surface;
- and
- at least one third semiconductor die bonded to the at least one third die bonding zone and electrically connected to the second flexible circuit board;
- wherein, the at least one third semiconductor die and the at least one second semiconductor die are alternatively vertically stacked above the at least one first semiconductor die by folding the first flexible circuit board and the second flexible circuit board to make the first die bonding zone, the at least one second die bonding zone and the at least one third die bonding zone overlap with each other to form the folded flexible circuit board structure, and a plurality of lead frame bonding pads under the first die bonding zone are formed on the third surface of the second flexible circuit board, and each of the lead frame bonding pads is electrically connected to each of the first die bonding pads corresponding thereof through a conductive hole;
- wherein, the folded flexible circuit board structure is vertically stacked on the lead frame and electrically connected therewith through the lead frame bonding pads.
8 more elements
Dependencies are inferred from the claim text.