Caesar Technology Inc.
Hsinchu, TW· latest recorded location
Caesar Technology Inc. is named on 8 US grants and 0 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 8
- Published applications
- 0
- Inventors
- 3
- Granted in 2026 so far
- 0
- Most recent grant
- 22 May 2001
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 0 |
By publication year.
Technology areas
Share of 8 documents
Recent patents
- Electronic device package with enhanced heat dissipation effect22 May 2001US 6,236,567 B1
- Heat spreader for ball grid array package19 Dec 2000US 6,163,458 A
- Chip scale package11 Jul 2000US 6,087,586 A
- Indicating adhesion status between substrate and encapsulant of a packaged electronic device30 May 2000US 6,068,129 A
- Heat sink23 May 2000US 6,067,228 A
No published applications.
Most cited
By later US patents