Indicating adhesion status between substrate and encapsulant of a packaged electronic device

A substrate to be used as a supporter for packaging an electronic device, comprising:

• a supporting face having a first region for installing the electronic device to be packaged thereon and a second region, said first region having adhesion of a first level to an encapsulant used in packaging the electronic device;
• a material disposed in at least one area on said supporting face in said second region, and having adhesion of a second level to the encapsulant, the adhesion of said second level being approximately equal to that of said first level;
• and
• a layer of material formed in said second region surrounding said at least one area, said layer of material having adhesion of a third level to the encapsulant, said third level of adhesion being less than that of said second level, wherein removal of said material in said at least one area by removal of encapsulant overlaying said second region indicates a desired level of adhesion between said first region of said supporting face and an overlaying layer of encapsulant thereon.

A packaged electronic device comprising:

• a substrate having a supporting face, said supporting face including an installation region and indicating region, said installation region having an electronic device mounted thereon;
• an encapsulation layer formed by an encapsulant material and covering said installation region, said indicating region, and said electronic device, a portion of said encapsulation layer covering said indicating region being adanted to be readily removed from a remaining portion of said encapsulation layer, said installation region having adhesion of a first level to said encapsulant material;
• a material disposed in at least one area in said indicating region and shaped to define an indicia pattern, said material in said at least one area having adhesion of a second level to said encapsulant material, the adhesion of said second level being approximately equal to that of said first level;
• and
• a layer of material formed in said indicating region surrounding said indicia pattern, said layer of material having adhesion of a third level to said encapsulant material, said third level of adhesion being less than that of said second level, wherein removal of said material in said at least one area by removal of said portion of said encapsulation layer indicates a desired level of adhesion between said installation region of said supporting face and said encapsulation layer.