Electronic device package with enhanced heat dissipation effect
AssigneeCaesar Technology Inc.
InventorShih-Li Chen
Life of this patent
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Abstract
An electronic device package with enhanced heat dissipation effect comprises a lead frame and an outer frame with electrically insulating surface. The outer frame encloses the electronic device with a predetermined gap therebetween. The lead frame has a plurality of inner leads extending to the upper surface of the electronic device and a plurality of outer leads enclosing the outer surface of the outer frame. Each inner lead and each outer lead are linked by a slanting portion. The plurality of outer leads includes at least one ground outer lead with larger cross section area than other outer leads. Therefore, the heat generated by the electronic device can be conducted outside through the ground outer lead when the ground outer lead is connected to other device.
Claims9
An electronic device package for facilitating heat dissipation of an electronic device, comprising:
- an outer frame having an insulating surface and enclosing said electronic device, said outer frame being displaced from said electronic device and defining a gap therebetween;
- a lead frame having a plurality of inner leads electrically connected to said electronic device, a plurality of outer leads surrounding the outer surface of said outer frame, a slanting portion linking said inner leads and said outer leads, said plurality of outer leads including at least one ground outer lead with a larger cross section area than said other outer leads.
Dependencies are inferred from the claim text.