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US 5,982,621 AGranted
Electronic device cooling arrangement
AssigneeCaesar Technology Inc.
Inventorji-Ming Li
Life of this patent
Estimating the term…
Abstract
An electronic device cooling arrangement includes a heat sink bonded to a substrate above a chip on the substrate, the heat sink having a mounting section bonded to the substrate, a face panel section suspended above the chip and defining a tapered center through hole, and a supporting frame section connected between the face panel section and the mounting section, and a tapered heat conductive block mounted in the tapered center through hole and bonded to the chip for quick dissipation of heat from the chip.
Claims20
An electronic device cooling arrangement comprising:
- a heat sink, said heat sink comprising a face panel section having a downwardly extended projecting portion defining a center through hole, supporting frame section downwardly outwardly extended from the periphery of said face panel section, and a mounting section integral with a bottom side of said supporting frame section remote from said face panel section and disposed at a lower elevation than said face panel section;
- and
- a heat conductive block mounted in the center through hole of said face panel section of said heat sink.
An electronic device cooling arrangement comprising:
- a substrate carrying a chip;
- a heat sink bonded to said substrate and covered on said chip, said heat sink comprising a face panel section suspended above said chip, said face panel section having a downwardly extended projecting portion defining a center through hole, a mounting section bonded to said substrate, and a supporting frame section connected between said face panel section and said mounting section;
- a heat conductive block mounted in the center through hole at said face panel section and disposed in contact with said chip;
- and
- an electrically insulative packing material molded on said heat sink.
2 more elements
Dependencies are inferred from the claim text.