Y10T 83/0378
On opposite sides of work
Y10T83/0378 (On opposite sides of work) appears on 57 US grants and 23 published applications in this corpus.
Search patents in Y10T- Granted patents
- 57
- Published applications
- 23
- Assignees
- 40
- Inventors
- 88
- Latest grant
- 17 Mar 2015
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 1 |
| 2002 | 1 | 3 |
| 2003 | 6 | 3 |
| 2004 | 1 | 5 |
| 2005 | 1 | 2 |
| 2006 | 3 | 2 |
| 2007 | 1 | 2 |
| 2008 | 2 | 0 |
| 2009 | 0 | 3 |
| 2010 | 2 | 1 |
| 2011 | 1 | 0 |
| 2012 | 2 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for cutting panel substrate and substrate cutting apparatus17 Mar 2015US 8,978,528 B2Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Device for the rotative scoring of flat printed products12 Jun 2012US 8,196,502 B2Kolbus GmbH & Co. KG
- Apparatus for cutting liquid crystal display panel14 Feb 2012US 8,113,401 B2LG Display Co., Ltd.
- Scribing and breaking apparatus and system therefor6 Sep 2011US 8,011,546 B2Mitsuboshi Diamond Industrial Co., Ltd.
- Plasma display panel cutting method13 Jul 2010US 7,753,752 B2Panasonic Corporation
- Method for cutting panel substrate and substrate cutting apparatus7 Feb 2013US 2013/0033672 A1Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Apparatus for cutting liquid crystal display panel14 Oct 2010US 2010/0258605 A1LG Display Co., Ltd.
- Plasma display panel cutting method, plasma display panel recycling method and plasma display panel cutting apparatus18 Jun 2009US 2009/0156081 A1Matsushita Electric Industrial Co., Ltd.
- Device for the rotative scoring of flat printed products23 Apr 2009US 2009/0100978 A1Kolbus GmbH & Co. KG
- Scribing and breaking apparatus and system therefor19 Mar 2009US 2009/0071995 A1Mitsuboshi Diamond Industrial Co., Ltd.
Most cited
By later US patents
- Method and system for dicing wafers, and semiconductor structures incorporating the products thereof63US 6,271,102 B1International Business Machines Corporation · 2001
- Method and apparatus for cutting a laminate made of a brittle material and a plastic58US 6,592,703 B1Schott Glas · 2003
- Arrangement for cutting and/or stripping apparatuses34US 5,010,797 A1991
- Apparatus for cutting laminated glass27US 4,558,622 A1985
- Fiber optic connector having fiber cutting means22US 4,422,715 AThomas & Betts Corporation · 1983