Method for cutting panel substrate and substrate cutting apparatus
AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorsDong Li, Feng She, Cheng-ming Huang
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Abstract
The present invention provides a method for cutting a panel substrate and a substrate cutting apparatus. The substrate cutting apparatus comprises a first cutting unit and a second cutting unit. The method comprises the following steps: cutting off a first residual material and a second residual material at two opposite sides of the panel substrate; cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate; cutting the panel substrate into a plurality of elongated substrates; and cutting each of the elongated substrates into the panel units. The present invention can reduce a process time for cutting the panel substrate.
Claims4
A method for cutting a panel substrate into a plurality of panel units, wherein the panel substrate is a glass substrate, and the method comprises the following steps:
- before cutting the panel substrate into a plurality of elongated substrates, utilizing a first cutting unit to cut off a first residual material and a second residual material at two opposite sides of the panel substrate;
- before cutting the panel substrate into the plurality of elongated substrates and after cutting off the first residual material and the second residual material, cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate;
- after cutting off the first residual material, the second residual material, the third residual material, and the fourth residual material, cutting the panel substrate into the plurality of elongated substrates;
- and
- cutting each of the elongated substrates into the panel units;
- wherein, when cutting off the first residual material, the panel substrate is transported to a rotatable stage, and then the panel substrate is fixed and held by the rotatable stage and the first cutting unit, and the first residual material at a first side of the panel substrate is cut off by the first cutting unit, and after using the first cutting unit to cut off the first residual material, the panel substrate fixed by the rotatable stage and the first cutting unit is released, and the rotatable stage is utilized to rotate the panel substrate by 180° for cutting off the second residual material.
Dependencies are inferred from the claim text.