Method for cutting panel substrate and substrate cutting apparatus
AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorsDong Li, Feng She, Cheng-ming Huang
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Abstract
The present invention provides a method for cutting a panel substrate and a substrate cutting apparatus. The substrate cutting apparatus comprises a first cutting unit and a second cutting unit. The method comprises the following steps: cutting off a first residual material and a second residual material at two opposite sides of the panel substrate; cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate; cutting the panel substrate into a plurality of elongated substrates; and cutting each of the elongated substrates into the panel units. The present invention can reduce a process time for cutting the panel substrate.
Claims12
A method for cutting a panel substrate into a plurality of panel units, wherein the method comprises the following steps:
- cutting off a first residual material and a second residual material at two opposite sides of the panel substrate;
- cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate;
- cutting the panel substrate into a plurality of elongated substrates;
- and
- cutting each of the elongated substrates into the panel units.
A substrate cutting apparatus for cutting a panel substrate into a plurality of panel units, wherein the substrate cutting apparatus comprises:
- a rotatable stage configured to rotate the panel substrate;
- a first cutting unit configured to cut off a first residual material, a second residual material, a third residual material and a fourth residual material of the panel substrate, and to cut the panel substrate into a plurality of elongated substrates;
- and
- a second cutting unit configured to cut each of the elongated substrates into the panel units.
A substrate cutting apparatus for cutting a panel substrate into a plurality of panel units, wherein the substrate cutting apparatus comprises:
- a pre-cutting unit configured to pre-cut off a first residual material and a second residual material of the panel substrate;
- a first cutting unit configured to cut off a third residual material and a fourth residual material of the panel substrate, and to cut the panel substrate into a plurality of elongated substrates;
- and
- a second cutting unit configured to cut each of the elongated substrates into the panel units.
Dependencies are inferred from the claim text.