Y10T 428/12431
Foil or filament smaller than 6 mils
Y10T428/12431 (Foil or filament smaller than 6 mils) appears on 907 US grants and 585 published applications in this corpus.
Search patents in Y10T- Granted patents
- 907
- Published applications
- 585
- Assignees
- 436
- Inventors
- 1,803
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 8 | 0 |
| 1978 | 7 | 0 |
| 1979 | 6 | 0 |
| 1980 | 7 | 0 |
| 1981 | 8 | 0 |
| 1982 | 15 | 0 |
| 1983 | 12 | 0 |
| 1984 | 21 | 0 |
| 1985 | 14 | 0 |
| 1986 | 15 | 0 |
| 1987 | 25 | 0 |
| 1988 | 24 | 0 |
| 1989 | 19 | 0 |
| 1990 | 14 | 0 |
| 1991 | 13 | 0 |
| 1992 | 15 | 0 |
| 1993 | 11 | 0 |
| 1994 | 14 | 0 |
| 1995 | 17 | 0 |
| 1996 | 17 | 0 |
| 1997 | 15 | 0 |
| 1998 | 16 | 0 |
| 1999 | 23 | 0 |
| 2000 | 27 | 0 |
| 2001 | 45 | 26 |
| 2002 | 40 | 41 |
| 2003 | 37 | 36 |
| 2004 | 34 | 63 |
| 2005 | 32 | 24 |
| 2006 | 26 | 17 |
| 2007 | 12 | 33 |
| 2008 | 7 | 26 |
| 2009 | 16 | 34 |
| 2010 | 29 | 24 |
| 2011 | 19 | 24 |
| 2012 | 17 | 28 |
| 2013 | 21 | 34 |
| 2014 | 24 | 41 |
| 2015 | 23 | 30 |
| 2016 | 25 | 8 |
| 2017 | 18 | 9 |
| 2018 | 14 | 12 |
| 2019 | 15 | 16 |
| 2020 | 19 | 14 |
| 2021 | 20 | 17 |
| 2022 | 18 | 7 |
| 2023 | 4 | 10 |
| 2024 | 14 | 6 |
| 2025 | 7 | 3 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Article having a heat-insulating coating system7 Jul 2026US 12,676,320 B2Forschungszentrum Julich GmbH
- Load-bearing structures3 Mar 2026US 12,565,300 B2Airbus Operations GmbH
- Flexible copper-clad laminate and printed circuit made therefrom3 Mar 2026US 12,568,577 B2Dupont Electronics, Inc.
- Joined body and electrostatic chuck20 Jan 2026US 12,528,131 B2Niterra Co., Ltd.
- Surface-treated copper foil16 Sep 2025US 12,415,340 B2Nippon Denkai, Ltd.
- Low-loss thin amorphous alloy strip and the manufacturing device and method thereof14 May 2026US 2026/0131367 A1
- Surface-treated copper foil16 Apr 2026US 2026/0107381 A1Dupont Electronics, Inc.
- Method of manufacturing composite metal foil17 Jul 2025US 2025/0230569 A1Industrial Technology Research Institute
- Rolled material10 Jul 2025US 2025/0223670 A1Proterial, Ltd.
- Pure copper material, insulating substrate, and electronic device3 Apr 2025US 2025/0109462 A1Mitsubishi Materials Corporation
Most cited
By later US patents
- Carbon nanotubes on a substrate231US 6,361,861 B1Battelle Memorial Institute · 2002
- Process for fabricating an array of nanowires197US 6,231,744 B1Massachusetts Institute of Technology · 2001
- Nanowire arrays159US 6,359,288 B1Massachusetts Institute of Technology · 2002
- Charge card149US 6,025,283 AThe Real Gold Card Company Limited · 2000
- Titanium-polymer hybrid laminates126US 6,114,050 AThe Boeing Company · 2000