Y10T 29/49218
With deforming
Official title: with deforming
Y10T29/49218 (With deforming) appears on 669 US grants and 399 published applications in this corpus.
Search patents in Y10T- Granted patents
- 669
- Published applications
- 399
- Assignees
- 330
- Inventors
- 1,019
- Latest grant
- 30 Jul 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 10 | 0 |
| 1978 | 9 | 0 |
| 1979 | 7 | 0 |
| 1980 | 14 | 0 |
| 1981 | 8 | 0 |
| 1982 | 6 | 0 |
| 1983 | 9 | 0 |
| 1984 | 13 | 0 |
| 1985 | 9 | 0 |
| 1986 | 9 | 0 |
| 1987 | 12 | 0 |
| 1988 | 9 | 0 |
| 1989 | 13 | 0 |
| 1990 | 7 | 0 |
| 1991 | 11 | 0 |
| 1992 | 8 | 0 |
| 1993 | 6 | 0 |
| 1994 | 10 | 0 |
| 1995 | 12 | 0 |
| 1996 | 15 | 0 |
| 1997 | 17 | 0 |
| 1998 | 15 | 0 |
| 1999 | 14 | 0 |
| 2000 | 19 | 0 |
| 2001 | 18 | 13 |
| 2002 | 21 | 27 |
| 2003 | 22 | 22 |
| 2004 | 24 | 21 |
| 2005 | 20 | 26 |
| 2006 | 21 | 26 |
| 2007 | 20 | 15 |
| 2008 | 29 | 55 |
| 2009 | 29 | 31 |
| 2010 | 29 | 31 |
| 2011 | 20 | 23 |
| 2012 | 23 | 24 |
| 2013 | 27 | 21 |
| 2014 | 32 | 31 |
| 2015 | 17 | 20 |
| 2016 | 23 | 5 |
| 2017 | 7 | 1 |
| 2018 | 4 | 0 |
| 2019 | 2 | 2 |
| 2020 | 2 | 2 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- High speed communication jack30 Jul 2024US 12,051,878 B2Sentinel Connector Systems, Inc.
- Crimping tool exchange device10 May 2022US 11,329,440 B2Komax Holding AG
- High speed communication jack10 Aug 2021US 11,088,494 B2Sentinel Connector Systems, Inc.
- Preparation method of rapid composite of long silver-graphite electrical contact material and solder strip material27 Oct 2020US 10,818,447 B2Wenzhou Hongfeng Electrical Alloy Co., Ltd.
- Interface structure14 Jul 2020US 10,714,851 B2Sensata Technologies, Inc.
- High Speed Communication Jack31 Oct 2024US 2024/0364059 A1Sentinel Connector Systems, Inc.
- Wire termination system8 Aug 2024US 2024/0266795 A1The Boeing Company
- High Speed Communication Jack16 Dec 2021US 2021/0391670 A1Sentinel Connector Systems, Inc.
- Preparation Method of Rapid Composite of Long Silver-graphite Electrical Contact Material and Solder Strip Material17 Sep 2020US 2020/0294734 A1Wenzhou Hongfeng Electrical Alloy Co., Ltd.
- High Speed Communication Jack12 Mar 2020US 2020/0083652 A1Sentinel Connector Systems, Inc.
Most cited
By later US patents
- Semiconductor connection components and methods with releasable lead support217US 5,536,909 ATessera, Inc. · 1996
- RF shielded blank for coaxial connector205US 4,131,332 AAMP Incorporated · 1978
- Method for manufacturing a high density connector157US 6,363,607 B1Hon Hai Precision Ind.Co., Ltd. · 2002
- Apparatus and method for retaining an insert in an electrical connector154US 4,703,987 AAmphenol Corporation · 1987
- Printed wiring board with mounted circuit element using a terminal density conversion board149US 5,936,843 AFujitsu Limited · 1999