High speed communication jack
AssigneeSentinel Connector Systems, Inc.
InventorBrett D. Robinson
Life of this patent
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Abstract
A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
Claims20
A high speed communication jack including:
- a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug;
- a shielding case surrounding the housing;
- a circuit board disposed in part between the shielding case and the housing, wherein the circuit board comprises a substrate having a first side and a second side opposite the first side,
- a plurality of pin vias extending through the substrate where each of the pin vias is configured to accommodate a pin on the housing,
- a plurality of traces on the first side of the substrate where each trace extends from a corresponding one of the plurality of pin vias;
- a shielding trace layer disposed on the first side of the substrate including a pair of shielding tabs disposed on opposite edges of the first side of the substrate and a shielding trace disposed on the first side of the substrate opposite the first plurality of pin vias where the shielding trace extends between and connects the shielding tabs,
- a first conductive layer between the first side and second side of the substrate;
- a third layer between the first conductive layer and the second side of the substrate, with the third layer having a signal return layer embedded in the first dielectric layer,
- a second conductive layer between the third layer and the second side of the substrate.
A method of making a high speed communication jack including the steps of:
- forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug;
- forming a shielding case surrounding the housing;
- forming a circuit board disposed in part between the shielding case and the housing,
- wherein the circuit board comprises forming a substrate having a first side and a second side opposite the first side,
- forming a plurality of pin vias extending through the substrate where each of the pin vias is configured to accommodate a pin on the housing,
- forming a plurality of traces on the first side of the substrate where each trace extends from a corresponding one of the plurality of pin vias;
- forming a shielding trace layer disposed on the first side of the substrate including a pair of shielding tabs disposed on opposite edges of the first side of the substrate and a shielding trace
- disposed on the first side of the substrate opposite the first plurality of pin vias where the shielding trace extends between and connects the shielding tabs,
- forming a first conductive layer between the first side and second side of the substrate;
- forming a third layer between the first conductive layer and the second side of the substrate, with the third layer having a signal return layer embedded in the first dielectric layer,
- forming a second conductive layer between the third layer and the second side of the substrate.
Dependencies are inferred from the claim text.