High Speed Communication Jack
AssigneeSentinel Connector Systems, Inc.
InventorBrett D Robinson
Life of this patent
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Abstract
A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
Claims20
A high speed communication jack including:
- a housing sized to configure a substrate in a lower portion of the housing;
- a plurality of traces formed on the substrate with each trace having a first portion and a second portion,
- wherein a width of each trace is variable along a length of the first portion and constant along a width of the second portion.
A method of forming a high speed communication jack including the steps of:
- forming a housing sized to configure a substrate in a lower portion of the housing;
- forming a plurality of traces formed on the substrate with each trace having a first portion and a second portion,
- wherein a width of each trace is variable along a length of the first portion and constant along a width of the second portion.
Dependencies are inferred from the claim text.