High speed communication jack
AssigneeSentinel Connector Systems, Inc.
InventorBrett D Robinson
Life of this patent
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Abstract
A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
Claims16
A method of manufacturing a high speed communication jack including the steps of:
- forming a first trace on a substrate;
- forming a second trace on the substrate with the second trace separated by the first trace by a predetermined distance;
- transmitting a signal on the first trace;
- transmitting the signal on the second trace;
- determining the loss between the signal on the first trace and second trace;
- adjust at least the length, width or height of the first and second traces until the loss is less than a predetermined level,
- wherein the high speed communication jack is an RJ 45 jack.
A method of manufacturing a high speed communication jack including the steps of:
- forming a first trace on a substrate;
- forming a second trace on the substrate with the second trace separated by the first trace by a predetermined distance;
- transmitting a signal on the first trace;
- transmitting the signal on the second trace;
- determining the loss between the signal on the first trace and second trace;
- adjust at least the length, width or height of the first and second traces until the loss is less than a predetermined level,
- wherein the high speed communication jack is a universal serial bus jack.
Dependencies are inferred from the claim text.