Y10T 156/15
Combined or convertible surface bonding means and/or assembly means
Y10T156/15 (Combined or convertible surface bonding means and/or assembly means) appears on 85 US grants and 86 published applications in this corpus.
Search patents in Y10T- Granted patents
- 85
- Published applications
- 86
- Assignees
- 61
- Inventors
- 156
- Latest grant
- 10 Mar 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 2 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 20 |
| 2009 | 1 | 2 |
| 2010 | 4 | 2 |
| 2011 | 8 | 8 |
| 2012 | 4 | 10 |
| 2013 | 9 | 12 |
| 2014 | 13 | 13 |
| 2015 | 13 | 8 |
| 2016 | 4 | 2 |
| 2017 | 4 | 1 |
| 2018 | 4 | 2 |
| 2019 | 2 | 1 |
| 2020 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Bonding apparatus and stack body manufacturing apparatus10 Mar 2020US 10,583,641 B2Semiconductor Energy Laboratory Co.Ltd.
- Hybrid bonding systems and methods for semiconductor wafers16 Jul 2019US 10,354,972 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Epitaxial lift off systems and methods16 Apr 2019US 10,259,206 B2Alta Devices, Inc.
- Recyclable surface covering and method and system for manufacturing a recyclable surface covering16 Oct 2018US 10,099,452 B2Ecore International Inc.
- Hybrid bonding systems and methods for semiconductor wafers16 Oct 2018US 10,103,122 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Recyclable surface covering and method and system for manufacturing a recyclable surface covering13 Aug 2020US 2020/0254733 A1Ecore International Inc.
- Hybrid Bonding Systems and Methods for Semiconductor Wafers14 Feb 2019US 2019/0051628 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus and process for the production of paper web material17 May 2018US 2018/0133999 A1Futura S.P. A.
- Bonding apparatus and stack body manufacturing apparatus15 Mar 2018US 2018/0072033 A1Semiconductor Energy Laboratory Co.Ltd.
- Hybrid Bonding Systems and Methods for Semiconductor Wafers14 Dec 2017US 2017/0358551 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Microwave purification process91US 7,905,942 B1SDCmaterials, Inc. · 2011
- Method and apparatus for making recyclable catalysts66US 8,076,258 B1SDCmaterials, Inc. · 2011
- Formation of catalytic regions within porous structures using supercritical phase processing62US 7,678,419 B2SDC Materials, Inc. · 2010
- Collecting particles from a fluid stream via thermophoresis62US 7,897,127 B2SDCmaterials, Inc. · 2011
- Long cool-down tube with air input joints62US 8,051,724 B1SDCmaterials, Inc. · 2011