Bonding apparatus and stack body manufacturing apparatus

A stack body manufacturing apparatus comprising:

• a first supply unit configured to supply a process member;
• a first separation unit configured to be supplied with the process member and to separate the process member into a first surface layer and a first remaining portion;
• a support body supply unit configured to supply a first support body and a second support body;
• a first bonding unit configured to be supplied with the first remaining portion and the first support body and to bond the first remaining portion and the first support body with a first bonding layer;
• a first unloading unit configured to unload a first stack body including the first remaining portion, the first bonding layer, and the first support body;
• a second supply unit configured to supply the first stack body;
• a trigger formation unit configured to be supplied with the first stack body and to form a separation trigger near an end portion of the first remaining portion;
• a second separation unit configured to be supplied with the first stack body including the separation trigger and to separate the first stack body into a second surface layer and a second remaining portion;
• a second bonding unit configured to be supplied with the second remaining portion and the second support body and to bond the second remaining portion and the second support body with a second bonding layer;
• and
• a second unloading unit configured to unload a second stack body including the second remaining portion, the second bonding layer, and the second support body,
• wherein the first bonding unit comprises a first bonding apparatus, and
• wherein the first bonding apparatus comprises:
• a first stage configured to support the first remaining portion;
• a first fixing mechanism configured to fix one end portion of the first support body so that the first support body overlaps with the first remaining portion;
• and
• a first pressurizing mechanism configured to move the first support body from side to side and to spread the first bonding layer under pressure between the first remaining portion and the first support body so that the first remaining portion and the first support body are bonded to each other with the first bonding layer therebetween.