H10N 30/852
Composite materials
Official title: {Composite materials, e.g. having 1-3 or 2-2 type connectivity}
H10N30/852 (Composite materials) appears on 531 US grants and 640 published applications in this corpus.
Search patents in H10N- Granted patents
- 531
- Published applications
- 640
- Assignees
- 325
- Inventors
- 1,310
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 6 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 3 |
| 2002 | 7 | 8 |
| 2003 | 3 | 2 |
| 2004 | 0 | 4 |
| 2005 | 4 | 8 |
| 2006 | 7 | 6 |
| 2007 | 1 | 15 |
| 2008 | 7 | 6 |
| 2009 | 8 | 3 |
| 2010 | 3 | 16 |
| 2011 | 6 | 21 |
| 2012 | 6 | 13 |
| 2013 | 10 | 27 |
| 2014 | 18 | 28 |
| 2015 | 21 | 39 |
| 2016 | 28 | 36 |
| 2017 | 28 | 27 |
| 2018 | 31 | 32 |
| 2019 | 34 | 57 |
| 2020 | 37 | 51 |
| 2021 | 33 | 30 |
| 2022 | 39 | 56 |
| 2023 | 29 | 65 |
| 2024 | 40 | 39 |
| 2025 | 37 | 33 |
| 2026 | 28 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photoacoustic sensor using micromachined ultrasonic transducers6 Oct 2026US 12,751,631 B2QUALCOMM Incorporated
- System and method for a self-protecting separator for a battery6 Oct 2026US 12,756,070 B2GM Global Technology Operations LLC
- Piezoelectric laminate, piezoelectric element, and manufacturing method for piezoelectric laminate15 Sep 2026US 12,740,323 B2FUJIFILM Corporation
- Polyolefin based piezoelectric polymer composite18 Aug 2026US 12,709,673 B2Sabic Global Technologies B.V.
- Flexible and low cost piezoelectric composites with high D33 values18 Aug 2026US 12,713,832 B2Sabic Global Technologies B.V.
- Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus24 Sep 2026US 2026/0293527 A1Seiko Epson Corporation
- Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus24 Sep 2026US 2026/0293528 A1Seiko Epson Corporation
- Piezoelectric energy harvester30 Jul 2026US 2026/0221901 A1Nitto Denko Corporation
- Method for preparing double-layer halide perovskite film using eco-friendly solvent, perovskite film prepared thereby and energy harvesting device comprising same16 Jul 2026US 2026/0206492 A1Iucf-Hyu (Industry-University Cooperation Foundation Hanyang University)
- Piezoelectric ceramic and piezoelectric element4 Jun 2026US 2026/0157114 A1KYOCERA Corporation
Most cited
By later US patents
- Nanowires, nanostructures and devices fabricated therefrom394US 6,882,051 B2The Regents of the University of California · 2005
- Methods of fabricating nanostructures and nanowires and devices fabricated therefrom247US 6,996,147 B2The Regents of the University of California · 2006
- Haptic feedback using composite piezoelectric actuator155US 8,390,594 B2Immersion Corporation · 2013
- Method for making an electronic device including a poled superlattice having a net electrical dipole moment126US 7,517,702 B2Mears Technologies, Inc. · 2009
- Method for making piezoelectric ceramic/polymer composite transducers122US 5,340,510 AMaterials Systems, Inc. · 1994