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US 12,713,832 B2Granted
Flexible and low cost piezoelectric composites with high D33 values
AssigneeSabic Global Technologies B.V.
InventorsJibran Khaliq, Sybrand Van Der Zwaag, Wilhelm Albert Groen, Jesus Alfonso Caraveo-Frescas
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Abstract
The disclosure concerns filled a polymer composite comprising a piezoelectric filler and a polymer resin. The composite may exhibit a piezoelectric coefficient d33 of greater than 30 pC/N when measured according to the Berlincourt Method using a d33 piezometer and a density of less than 5 g/cc according to the Archimedes method.
Claims5
A method of forming a piezoelectric composite, the method comprising:
- processing a piezoelectric filler to form a piezoelectric powder, wherein the piezoelectric powder comprises particulate having a size of from about 1 μm to about 3 μm;
- combining a polymer resin comprising a ferroelectric fluoropolymer and a solvent to provide a solution;
- combining the piezoelectric powder with the solution to provide a piezoelectric solution;
- and
- forming a film from the piezoelectric solution,
- wherein the processing comprises heating the piezoelectric powder to a temperature of at least 1050° C. to 1200° C.
3 more elements
Dependencies are inferred from the claim text.