H10N 10/81
Structural details of the junction
H10N10/81 (Structural details of the junction) appears on 517 US grants and 725 published applications in this corpus.
Search patents in H10N- Granted patents
- 517
- Published applications
- 725
- Assignees
- 330
- Inventors
- 1,383
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 10 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 7 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 1 |
| 2002 | 3 | 7 |
| 2003 | 3 | 4 |
| 2004 | 5 | 3 |
| 2005 | 1 | 10 |
| 2006 | 2 | 13 |
| 2007 | 4 | 7 |
| 2008 | 1 | 7 |
| 2009 | 1 | 8 |
| 2010 | 5 | 17 |
| 2011 | 6 | 20 |
| 2012 | 2 | 13 |
| 2013 | 9 | 32 |
| 2014 | 14 | 32 |
| 2015 | 13 | 35 |
| 2016 | 26 | 58 |
| 2017 | 27 | 42 |
| 2018 | 28 | 64 |
| 2019 | 35 | 56 |
| 2020 | 36 | 69 |
| 2021 | 41 | 66 |
| 2022 | 47 | 37 |
| 2023 | 41 | 47 |
| 2024 | 46 | 38 |
| 2025 | 25 | 22 |
| 2026 | 11 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Mass fabrication method for a spacer inserted thermoelectric device15 Sep 2026US 12,740,320 B2Industry-Academic Cooperation Foundation, Yonsei University
- Thermoelectric cooling modules4 Aug 2026US 12,701,916 B2Apple Inc.
- Polymer-derived ceramic thin film thermocouple and preparation method thereof9 Jun 2026US 12,652,955 B2
- Locking device formed of thermally adaptive multi-metallic material and a thermoelectric junction and method of manufacturing the same19 May 2026US 12,635,412 B2Hamilton Sundstrand Corporation
- Transmission electron microscope in-situ chip and preparation method therefor28 Apr 2026US 12,614,694 B2Xiamen Chip-Nova Technology Co., Ltd.
- Method for fabricating a thermoelectric device on ceramics24 Sep 2026US 2026/0293523 A1Sheetak, Inc.
- Method of manufacturing low-cost and high-strength thermoelectric module with simplified manufacturing process27 Aug 2026US 2026/0255876 A1Rmaterials Corporation
- Curved conformal wireless passive heat flux sensor and preparation method thereof20 Aug 2026US 2026/0243609 A1North University of China
- Cylindrical eco-friendly temperature system16 Jul 2026US 2026/0202104 A1Sheetak, Inc.
- Thermoelectric module array and power generation system including same16 Jul 2026US 2026/0206489 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Thermocouples479US 7,753,584 B2Mesoscribe Technologies, Inc. · 2010
- Thin-film thermoelectric device and fabrication method of same236US 6,300,150 B1Research Triangle Institute · 2001
- Thermoelectric heterostructure assemblies element83US 6,812,395 B2Bsst LLC · 2004
- Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags77US 7,164,077 B2Research Triangle Institute · 2007
- Thermoelectric cooler74US 5,441,576 A1995