Method of manufacturing low-cost and high-strength thermoelectric module with simplified manufacturing process

A method of manufacturing a low-cost and high-strength thermoelectric module, the method comprising:

• a lower metal thin film punching operation (S110) of covering an upper surface of a support (110), in which a plurality of through holes (111) are formed to form a tunnel diffusion barrier, with a metal thin film (130) for the diffusion barrier and punching and inserting the metal thin film (130) for the diffusion barrier to match a size of each of the through holes (111);
• a thermoelectric powder filling operation (S120) of filling a space above the metal thin film (130) for the diffusion barrier, which is inserted into each of the through holes (111) of the support (110), with a p-type thermoelectric powder and an n-type thermoelectric powder;
• an upper metal thin film punching operation (S130) of covering the upper surface of the support (110) with the metal thin film (130) for the diffusion barrier and punching and inserting the metal thin film (130) for the diffusion barrier to match the size of each of the through holes (111);
• a thermoelectric material sintering operation (S140) of sintering the p-type thermoelectric powder and the n-type thermoelectric powder by simultaneously applying a predetermined pressure to an upper surface and a lower surface of each of the through holes (111) of the support (110) and heating inside of the through hole (111) at a predetermined temperature;
• and
• a thermoelectric module completing operation (S150) of completing a thermoelectric module by mounting ceramic substrates on the upper surface and the lower surface of each of the through holes (111) that have passed through the thermoelectric material sintering operation.