H10H 20/8585
Being an interconnection
Official title: {being an interconnection}
H10H20/8585 (Being an interconnection) appears on 952 US grants and 1,185 published applications in this corpus.
Search patents in H10H- Granted patents
- 952
- Published applications
- 1,185
- Assignees
- 361
- Inventors
- 1,736
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 4 |
| 2002 | 13 | 15 |
| 2003 | 11 | 18 |
| 2004 | 10 | 25 |
| 2005 | 16 | 25 |
| 2006 | 10 | 36 |
| 2007 | 20 | 38 |
| 2008 | 14 | 48 |
| 2009 | 24 | 52 |
| 2010 | 30 | 43 |
| 2011 | 41 | 72 |
| 2012 | 50 | 79 |
| 2013 | 61 | 81 |
| 2014 | 61 | 54 |
| 2015 | 77 | 77 |
| 2016 | 66 | 78 |
| 2017 | 72 | 64 |
| 2018 | 56 | 93 |
| 2019 | 78 | 74 |
| 2020 | 73 | 64 |
| 2021 | 57 | 43 |
| 2022 | 22 | 32 |
| 2023 | 28 | 19 |
| 2024 | 26 | 19 |
| 2025 | 16 | 20 |
| 2026 | 5 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display substrate including heat dissipation hole structure and display device15 Sep 2026US 12,740,146 B2Boe Technology Group Co., Ltd.
- Light source device18 Aug 2026US 12,713,751 B2Olympus Medical Systems Corp.
- Semiconductor light emitting device package24 Mar 2026US 12,588,344 B2Samsung Electronics Co., Ltd.
- Light source module and display device17 Mar 2026US 12,581,783 B2Huizhou China Star Optoelectronics Display Co., Ltd.
- Header for semiconductor package, and semiconductor package20 Jan 2026US 12,532,589 B2Shinko Electric Industries Co., Ltd.
- Light emitting module and light system including the same10 Sep 2026US 2026/0271471 A1Seoul Viosys Co., Ltd.
- Integrated thermal throttling in light-emitting diode chips and packages20 Aug 2026US 2026/0247768 A1CreeLED, Inc.
- Electrode mounting structures with thermal pathways for light-emitting diode devices20 Aug 2026US 2026/0247779 A1CreeLED, Inc.
- Light-emitting device2 Jul 2026US 2026/0190559 A1Nichia Corporation
- Led with tuned luminance profile25 Jun 2026US 2026/0182096 A1Lumileds LLC
Most cited
By later US patents
- Light emitting diode package and fabrication method thereof467US 8,735,931 B2Samsung Electronics Co., Ltd. · 2014
- Arrays of optoelectronic devices and method of making same426US 5,660,461 AQuantum Devices, Inc. · 1997
- Semiconductor radiation emitter package423US 6,335,548 B12002
- LED integrated heat sink341US 6,517,218 B2Relume Corporation · 2003
- High power LED305US 6,541,800 B2Weldon Technologies, Inc. · 2003