Electrode mounting structures with thermal pathways for light-emitting diode devices

A light-emitting diode (LED) module comprising:

• a board;
• and
• a plurality of LED devices on the board, each LED device of the plurality of LED devices comprising:
• a support element comprising a metal core, a dielectric layer on the metal core, a first mounting pad, and a second mounting pad, the first mounting pad forming part of a direct thermal and electrical path through the dielectric layer to the metal core, the second mounting pad being electrically isolated from the metal core;
• and
• a first LED chip mounted to the support element and electrically coupled to the first mounting pad and the second mounting pad, the first LED chip comprising a first bond pad that is mounted and electrically coupled to the first mounting pad.

A light-emitting diode (LED) fixture comprising:

• a housing;
• and
• an LED device mounted on the housing, the LED device comprising:
• a support element comprising a metal core, a dielectric layer on the metal core, a first mounting pad, and a second mounting pad, the first mounting pad forming part of a direct thermal and electrical path through the dielectric layer to the metal core, the second mounting pad being electrically isolated from the metal core;
• and
• a first LED chip mounted to the support element and electrically coupled to the first mounting pad and the second mounting pad, the first LED chip comprising a first bond pad that is mounted and electrically coupled to the first mounting pad.